Microstructures and properties of Sn-Ag-Cu lead-free
 solder alloys containing La

ZHOUYing-chun(周迎春),PANQing-lin(潘清林),HEYun-bin(何运斌),LIANGWen-jie(梁文杰)LIWen-bin(李文斌),LIYun-chun(李运春),LUCong-ge(路聪阁)

Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (Special 1) : 1043-1048.

The Nonferrous Metals Society of China
Transactions of Nonferrous Metals Society of China ›› 2007, Vol. 17 ›› Issue (Special 1) : 1043-1048.
Special Functional Materials

Microstructures and properties of Sn-Ag-Cu lead-free
 solder alloys containing La

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2007, 17(Special 1): 1043-1048

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